{"id":"9942670535","title":"Module Engineer","posted_at":"2026-11-12T10:03:26.000Z","apply_url":"https://intel.wd1.myworkdayjobs.com/en-US/External/job/PRC-Chengdu/Module-Engineer_JR0289088-1","locations":["PRC, Chengdu, China"],"employment_type":"full_time","workplace_type":"on_site","seniority_level":null,"description_language":"en","source_name":"workday","source_url":"https://intel.wd1.myworkdayjobs.com/en-US/External/job/PRC-Chengdu/Module-Engineer_JR0289088-1","salary":null,"job_summary":null,"job_description":null,"description_text":"**Job Details:**\n\n**Job Description:**\n\nThe Role and Impact\nWe are looking for a talented and driven professional to join our team as a Technical Contributor. In this role, you will play a key part in advancing technical solutions and processes that directly impact Intel's ability to deliver innovative products and services to customers worldwide. You will focus on developing, implementing, and optimizing technologies related to Die Prep or Die Sort module technology, enabling critical advancements in precision manufacturing and quality assurance.\n\nBusiness Group\nYou will be part of Intel Corporation, a leading technology company committed to shaping the future of computing and connectivity. Within the Die Prep or Die Sort module group, you will contribute to groundbreaking work that supports the design, development, and manufacturing processes at Intel. This team focuses on driving innovation in Die Prep and Die Sort technology, ensuring Intel's leadership in cutting-edge solutions.\n\nKey Responsibilities\n- Own process control, equipment performance, and manufacturing readiness for the assigned Die Prep or Die Sort module.\n- Drive improvements in safety, quality, yield, productivity, utilization, and cost through engineering solutions.\n- Lead troubleshooting and root-cause analysis of process, equipment, and quality issues, implementing sustainable corrective actions.\n- Develop, optimize, and maintain process recipes, control limits, specifications, and equipment operating conditions.\n- Support equipment installation, qualification, NPI transfers, and high-volume manufacturing (HVM) ramp activities.\n- Collaborate with cross-functional teams to improve manufacturing capability, capacity, automation, and operational excellence while standardizing best-known methods (BKM).\n\n**Qualifications:**\n\nMinimum Qualifications\n- Bachelor's or Master's degree in Engineering, Physics, Materials Science, or related discipline.\n- Strong analytical thinking and structured problem-solving skills.\n- Basic knowledge of DOE, SPC, and statistical analysis.\n- Experience working with manufacturing data and process control systems.\n- Strong communication and collaboration skills in a fast-paced environment.\nPreferred Qualifications\n- Semiconductor or advanced manufacturing experience.\n- Experience in process/equipment qualification, NPI, and production ramp.\n- Knowledge of SPC, FMEA, DOE, and root-cause analysis methodologies.\n- Experience with automation, programming, SQL, or manufacturing data analytics.\n- Familiarity with Die Prep/Die Sort processes, equipment, inspection, or automation systems.\n\n**Job Type:**\n\nIntel Contract Employee\n\n**Shift:**\n\nShift 1 (China)\n\n**Primary Location:**\n\nPRC, Chengdu\n\n**Additional Locations:**\n\n**Posting Statement:**\n\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.\n\n**Position of Trust**\n\nN/A\n\n**Work Model for this Role**\n\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.\n\n*\n\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","visa_sponsorship":null,"experience_years_min":null,"job_address":null,"job_city":null,"job_state":null,"job_country":"CN","location_lat":30.659867,"location_lng":104.063315,"closed_at":null,"closes_at":null,"apply_with_ai_eligible":true,"keywords":["Quality Assurance","cross-functional","collaboration","qualification","communication","Collaborate","performance","engineering","production","automation","compliance","analytics","business","leading","ethical","develop","design","teams","local","data","SQL"],"company":{"name":"Intel","slug":"intel","logo_url":"https://img.logo.dev/intel.com?token=pk_X1kMlqZGQKyGs3nVekpDWQ&size=64&format=png&fallback=404","description":"Intel is a global technology company that designs and manufactures semiconductor chips and computing hardware.","website_url":"https://intel.com","linkedin_url":null,"glassdoor_url":"https://www.glassdoor.com/Overview/Working-at-Intel-Corporation-EI_IE1519.11,28.htm","x_url":"https://x.com/intel","instagram_url":"https://www.instagram.com/intel","youtube_url":"https://www.youtube.com/c/Intel","github_url":"https://github.com/intel","huggingface_url":null,"tiktok_url":"https://www.tiktok.com/@intel","crunchbase_url":"https://www.crunchbase.com/organization/intel","facebook_url":"https://www.facebook.com/Intel","employee_count_range":null,"employee_count":null,"founded_year":null,"headquarters":{"address":"2200 Mission College Blvd, Santa Clara, CA 95054","city":null,"country":null,"lat":37.3862051,"lng":-121.96366359999999},"industry":null,"company_type":null,"total_funding_usd":null,"locations":["Albuquerque, NM","Arizona, USA","Austin, TX","Austria, Villach","Bengaluru, India","California, USA","Canada, Toronto","Chandler, AZ","Colorado, USA","Costa Rica, San Jose","Folsom, CA","Gdansk, Poland","Germany, Munich","Guadalajara, Mexico","Haifa, Israel","Hillsboro, OR","Ho_Chi_Minh_City, Vietnam","Hsinchu, Taiwan","India, Bangalore","Ireland, Leixlip","Israel, Haifa","Israel, Jerusalem","Israel, Kiryat-Gat","Israel, Petah-Tikva","Japan, Tokyo","Jerusalem, Israel","Kiryat-Gat, Israel","Kulim, Malaysia","Leixlip, Ireland","Malaysia","Malaysia, Kulim","Massachusetts, USA","Mexico, Guadalajara","Munich, Germany","New Mexico, USA","New York, USA","Ohio, USA","Oregon","Oregon, USA","PRC, Chengdu","PRC, China","PRC, Shenzhen","Penang, Malaysia","Pennsylvania, USA","Petah Tikva, Israel","Petah-Tikva, Israel","Phoenix, AZ","Poland, Gdansk","Primary","Rio Rancho, NM","Riyadh, Saudi Arabia","Romania, Timisoara","San Jose, Costa Rica","Santa Clara, CA","Saudi Arabia, Riyadh","Seoul, South Korea","South Korea, Seoul","Taipei, Taiwan","Taiwan, Hsinchu","Taiwan, Taipei","Texas, USA","Tokyo, Japan","Toronto, Canada","US, AZ","US, CA","US, OR","US, TX","Vietnam, Ho_Chi_Minh_City","Virginia, USA","Virtual Brazil","Virtual Canada","Virtual China","Virtual Germany","Virtual India","Virtual Mexico","Virtual Netherlands","Virtual Philippines","Virtual South Korea","Virtual US","Virtual United Kingdom","Virtual Vietnam","Virtual, China","Virtual, India","Virtual, Malaysia","Virtual, United Kingdom","Washington, USA"]},"visa_sponsorship_source":null,"h1b_filings":null,"can_apply":true,"application":null}